Microplex has developed a hermetic, copper based hole fill (TSV, Through Silicon Vias) for silicon wafers.

The customer supplies us with silicon wafers with through holes and a silicon oxide layer on the wafer surfaces and inside the holes. Our TSV processing is done at 900° C and 600° C. After the TSV processing, the wafers are ready for CMP to remove the bumps over the holes.

The copper we use is porous and has more “give” in it than plated copper, resulting in lower stress on the silicon surrounding the holes.

The process also allows for higher aspect ratios.