THICK FILM CAPABILITIES
SUBSTRATE
ALUMINA
ALUMINUM NITRIDE
BeO
QUARTZ
SAPPHIRE
SILICON
GLASS
STAINLESS STEEL
CONDUCTOR
Au (Gold)
PdAu (Palladium/Gold)
Pt (Platinum)
Ag (Silver)
PdAg (Palladium/Silver)
PtAg (Platinum/Silver) and Others
RESISTOR
0.1 OHM to 100 GIGAOHM
CAPACITOR
to 0.156 microfarads printed on substrate higher values available in SMT
or wire bonded chips
INDUCTOR to 150 microhenrys printed on substrate higher values available in SMT or wire bonded chips
LINE AND SPACE 3 MILS Printed 1 MIL Etched
PROCESSING FEATURES
MULTI-LAYERS
TRANSFER TAPE
LTCC (low-temp co-fired ceramic)
DICING
VIAS
WRAPAROUND
LASER TRIMMING
PLATING
DIE ATTACH
WIRE BONDING