SUBSTRATE:

• ALUMINA
  
• ALUMINUM NITRIDE
  
• BeO
  
• QUARTZ
  
• SAPPHIRE
  
• SILICON
  
• GLASS
  
• STAINLESS STEEL

CONDUCTOR:

• Au (Gold)
  
• PdAu (Palladium/Gold)
  
• Pt (Platinum)
  
• Ag (Silver)
  
• PdAg (Palladium/Silver)
  
• PtAg (Platinum/Silver) and others
  
  

RESISTOR:
0.1 OHM to 100 GIGAOHM

CAPACITOR:
to 0.156 microfarads printed on substrate higher values available in SMT or wire bonded chips

INDUCTOR:
To 150 microhenrys printed on substrate higher values available in SMT or wire bonded chips

LINE AND SPACE:
3 MILS Printed 1 MIL Etched

PROCESSING FEATURES:

• MULTI-LAYERS
  
• TRANSFER TAPE
  
• LTCC (low-temp co-fired ceramic)
  
• DICING
  
• VIAS
  
• WRAPAROUND
  
• LASER TRIMMING
  
• PLATING
  
• DIE ATTACH
  
• WIRE BONDING