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Conductive Vias Through Glass Wafers (TGV)





Microplex fills vias through glass and glass-ceramic substrate wafers for customers in industrial and government applications requiring small via diameters, tight via pitch, high aspect ratios, and optimal thermal expansion matching. Glass and glass-ceramic wafers can be sourced by our customers with pre-fabricated via holes, or can be sourced by Microplex through our supplier base. We have developed via conductor filling processes and can use various conductive metals: copper, silver, and gold. Subsequent to the via fabrication processes, wafers can be chemical-mechanical polished to achieve necessary the via to wafer surface planarization as required.


TGV Data Sheet

Thru-Glass Vias (TGV) Data Sheet









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Ceramic Via Fill Silicon Via Fill (TSV) Glass Via Fill (TGV) Quartz Via Fill (TQV) Electrical Feed-Throughs Thick Film Circuits Etched Gold Circuits