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Conductive Vias Through
Glass Wafers (TGV) |
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Microplex fills vias through glass and glass-ceramic substrate wafers for customers in industrial and government applications requiring small via diameters, tight via pitch, high aspect ratios, and optimal thermal expansion matching. Glass and glass-ceramic wafers can be sourced by our customers with pre-fabricated via holes, or can be sourced by Microplex through our supplier base. We have developed via conductor filling processes and can use various conductive metals: copper, silver, and gold. Subsequent to the via fabrication processes, wafers can be chemical-mechanical polished to achieve necessary the via to wafer surface planarization as required. Thru-Glass Vias (TGV) Data Sheet
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Home • Ceramic Via Fill • Silicon Via Fill (TSV) • Glass Via Fill
(TGV) • Quartz Via Fill (TQV) • Electrical Feed-Throughs • Thick
Film Circuits • Etched Gold Circuits •