THICK FILM PRODUCTS AND SERVICES
WHY THICK FILM?
Thick Film technology is ideally suited when quick turnaround is required for complex, high density multi-layer, low cost, high volume applications. It is also extremely effective for development work, quite often surpassing PCB turnaround. The ability to print resistors, capacitors, and inductors on ceramic based substrates allows for increased package density and reliability. Microplex's technology and processing provides the ideal solution bridging monolithic integrated circuits and standard printed circuit board technology.
CUSTOM SUBSTRATE PRODUCTS
- SINGLE LAYER THICK FILM HYBRID SUBSTRATES
- MULTI-LAYER THICK FILM HYBRID SUBSTRATES
- RF AND MICROWAVE HYBRID SUBSTRATE ASSEMBLIES
- SPECIAL CUSTOM HYBRID ASSEMBLIES
- POWER HYBRID CIRCUIT SUBSTRATES
- POWER LASER DIODE BLOCKS
PASSIVE PRODUCTS
- CHIP RESISTORS
- RESISTOR ARRAYS
- CUSTOM RC NETWORKS
- CUSTOM RLC NETWORKS
SERVICES
- DESIGN AND DEVELOPMENT OF MULTI-LAYER SUBSTRATES
- DESIGN AND DEVELOPMENT OF SPECIALTY HYBRID PRODUCTS
- THICK FILM METALIZATION
- PROTOTYPE QUICK RESPONSE AND TURN-AROUND
- HIGH VOLUME CONTRACT MANUFACTURING