header navigation graphic Ceramic Hole Fill button Chip Resistor button High Frequency Power Chip Resistors Hermetic Boxes & Packages button Microwave Product Capability button Thick Film Circuits button Specialty Products button Ceramic Hole Fill button Chip Resistor button High Frequency Power Chip Resistors Hermetic Boxes & Packages button Microwave Product Capability button Thick Film Circuits button Specialty Products button
         
   

Electrical Feed Through Vias for Silicon Wafers

   
   

Hermetic interconnects for chip enclosures, and multichip packages. Low cost replacement for machined hermetic connectors. Feed-throughs are available in stainless steel, aluminum, various ceramics, and other materials as needed.

Microplex offers the capability to fabricate small connector feed-throughs for device packages. These conductive feed-throughs can be designed to penetrate silicon, alumina, glass, quartz, AlN, aluminum, and steel materials. Additional features include fine via diameters, tight pitches, and assured hermeticity if required.

   
         
Microplex, Inc. footer graphic email link
 


Home Ceramic Via Fill Silicon Via Fill (TSV) Glass Via Fill (TGV) Quartz Via Fill (TQV) Electrical Feed-Throughs Thick Film Circuits Etched Gold Circuits


 

email link