• Eliminate expensive multiple screenings
  
• Wrap-around terminations provide assembly ease and reliability
  
• Allows high density packaging
  
• Can be wave-soldered directly to the back of a P.C. board
  
• Can be color-coded for identification
  
• High reliability-manufactured to meet MIL-R-55342C standards (see chart)
  
• High purity alumina substrate
  
• Precision performance resulting from tight TCP, close tracking and excellent environmental performance
  
• Precision laser trimmed
  
  

TYPICAL CHARACTERISTICS

SPECIFICATIONS

HOW TO ORDER