CASE HISTORIES & APPLICATIONS
CASE 1: MEDICAL
ISSUE: Medical company wanted to develop diagnostic device requiring
silicon transducers at a cost target not achievable with packaged devices.
SOLUTION: Microplex developed
the thick film circuit and processes to mount silicon transducer chips
directly on substrate.
RESULT: Product cost and performance objectives achieved
CASE 2: AVIATION
ISSUE: Customer had to redesign existing assembly used in aircraft to accommodate additional performance features. Using standard thin film approach, redesign effort exceeded existing volume and dimensions of assembly. This would require a major redesign of entire package and major re-qualification with FAA.
SOLUTION: Microplex designed a multilayer thick film hybrid substrate incorporating all design changes within the volume and dimensional constraints of original assembly.
RESULT: Customer was able to rapidly implement improved performance without a timely and costly major re-qualification with FAA.
CASE 3: COMMUNICATIONS
ISSUE: Company had difficulty mounting power laser diodes on thin film blocks.
SOLUTION: Microplex developed thick film blocks which allowed customer to build working parts for field introduction.
RESULT: The quick turnaround and Microplex's manufacturing capability provided the customer with a 6 to 9 month head start in the market with a new product.
CASE 4: SENSORS
ISSUE: An Instrument company had a problem with a complex wirebond/die attach requirement.
SOLUTION: Microplex bonded four (4 ) wires to the die followed by a face down die attach over a beveled hole in a ceramic substrate.
RESULT: Customer was able to build an instrument to measure fluid characteristics as the fluid flows across the beveled hole and the sensing die.