Please take a look at these processing capabilities and click their links for more details:

CERAMIC HOLE FILL
Hermetic hole fill for thin film circuits. Hole fill materials are gold, silver, and copper. We also provide copper and silver fill with gold caps on the surface.

SILICON HOLE FILL - TSV
Hermetic TSV for silicon wafers using copper hole fill.

CHIP RESISTORS
Standard line of thick film chip resistors manufactured in our facility. If parts are not in stock, delivery is 3-6 weeks.

HIGH FREQUENCY POWER CHIP RESISTORS
Standard and custom designs available.

HERMETIC BOXES AND PACKAGES
Hermetic interconnects for boxes, enclosures, and packages. Replacement for hermetic connectors.

MICROWAVE PRODUCT CAPABILITY
Etched circuits for good line resolution and thick film and package integration, power chip resistors, and custom attenuators.

THICK FILM CIRCUITS
Standard thick film capability.

SPECIALTY PRODUCTS
Ceramic burn in boards for semiconductors; x-ray and neutron detectors; heaters.

Our facilities at 1070 Ortega Way, Placentia, CA 92870-7124

The Microplex cleanroom